OSP PCB

White solder mask OSP PCB board

Manufacturing Capabilities

Features	Capabilities
Layers	1 to 24 layers
Base Materials	FR4, High TG FR4,CEM-3,CEM-1,Aluminum Base, Rogers,Halogen Free
Base Copper Thickness	0.5 oz to 5 oz
Finished Copper Thickness	1 oz to 5 oz
Board Thickness	0.2mm to 6.0mm
Maximum Panel Size	520mm x 1200mm
Finished Hole Size	0.1mm to 6.3mm
Hole Size Tolerance	NPTH: ±0.05mm; PTH: ±0.076mm
Aspect Ratio	8:01
Blind or Buried Via	Yes
Minimum Trace Width / Spacing	0.002" / 0.002"
Impendance Control Tolerance	±5%
Solder mask Type	LPI
Solder mask / Silk screen Color	Green, Black, White, Blue, Yellow, Red, etc…
Surface Finish Type	HASL, HASL + Lead Free, Immersion Gold, Flash Gold, Immersion Tin,
	Immersion Silver, OSP,
Carbon Ink	Yes
Peelable Mask	Yes